automatic Infrared BGA Reflow Oven/ IC QF Reflow Oven T-962

Voltage :AC220V/110V Dimensions :37.5*24*37.5cm Weight :10KG Temperature Range :100aa-350aa Cycle Time :1-8 min * automatic Infrared BGA Reflow Oven/ IC QF Reflow Oven T-962 Item specifics**   *  ***     *   **    ***   ****     *     **       *      *   *         * Place of OriginModel NumberVoltageDimensionsWeightTemperature RangeCycle TimeMaximum Soldering AreaPutout Power

Guangdong, China (Mainland)

Infrared Reflow oven T-962

AC220V/110V

37.5*24*37.5cm

10KG

100°C-350°C

1-8 min

180*235 mm

800W

Products features**                    ***           *          **  * ***         ***      * *          *     *  Infrared reflow oven T962 is a micro-processor controlled reflow oven. The device is powered by standard 110VAC 50/60HZ (220VAC Model is available). User interface is implemented by way of T962 input keys and an LCD display. Pre-Set heating Modes are selected by user interaction with thermal cycle progress observed on LCD display.This self-contained reflow station allows safe soldering techniques and the manipulation of SMDBAG and other small electronic parts mounted on a PCB assembly. The T962 may be used to automatically re-flow solder to correct bad solder joints, remove/replace bad components and complete small engineering models or prototypes. A windowed drawer is designed to hold the work-piece. Thermal cycle accuracy is maintained by closed loop micro-computer control with infrared heaters, thermocouple and circulating air.Ø       The T962 is a self-contained Micro-Processor controlled IC Heater and solder rework station. Ø       Uses up to 800 watts of energy efficient Infrared heating and air circulation to re-flow solder in a large 180×235mm area. Ø       Parameters of Eight (8) Soldering cycles are Pre-Defined Ø       Soldering cycles are keypad selected and progress displayed on the T962 LCD. Ø       A single windowed drawer holds assemblies within the heating chamber, Ø       The T962 design is ergonomic, practical and easily operated. Ø       The entire soldering process is completes automatically from Preheat, Soak and Reflow through cool- down. Ø       The T962 design is ergonomic, practical and easily operated. Ø       The T962 is an economical rework solution from single runs to on-demand small batch production. Ø       Light weight and a small footprint allows the T962 to be easily bench positioned transported or stored. Ø       The T962 can solder most bosseyed or double-face PCB boards small parts, ie.: CHIPSOPPLCCQFPBGA etc; Can be used to the gum of the product solid, turning the circuit board hot aging, maintaining the PCB board and so on. Be satisfied to the needs of academe, smallorder run and extensively development of enterprise & company  Technical Parameter****             *   ***           *                   **                  *

Supply Voltage	AC110V/ 50Hz      AC220V /52Hz
Putout Power	800W
Maximum Soldering Area	180×235 mm
Temperature Range	100-350
Cycle Time	18 mi

 Parts Inventory***                **                *                    ***          **            * 

Description	Quantity	Illustration
T962 Main Assembly	1
Power Cable110VAC or 200VAC	1
5mm Fuse, 10A 250VACFast Blow          (Spare)	1
This Manual on CD	1

picture***              **                *            **      ****          **                 ***             *          *****                       **              **             *    

automatic Infrared BGA Reflow Oven/ IC QF Reflow Oven T-962